The company’s next-generation foldable phone, the Honour Magic V3, was introduced in China in July and may soon be available in international markets. On a popular performance benchmarking website, a new smartphone version has been spotted, providing us with a preview of what to expect from the device should it be released in other regions. The smartphone manufacturer will probably give the Magic V3 foldable phone the same specs as the model introduced in China.
MySmartPrice came across a Geekbench listing for a device with the model number “FCP-N49.” The entry details the device’s octa core processor, which received 1,914 points in the single-core test and 5,354 points in the multi-core test. The listing states that the prime core of the chipset has a maximum clock speed of 3.30GHz.
This phone will have an Adreno 750 GPU. According to benchmark data, CPU frequency, and GPU information, the Honour Magic V3 will be powered by the Snapdragon 8 Gen 3 chipset, which is the company’s flagship processor that will be released in 2023. It has 12GB of RAM listed as a feature.
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